Prof. Takao Someya and his team at the Graduate School of Engineering, in collaboration with senior research scientist Kenjiro Fukuda and his colleagues at RIKEN and Professor Shinjiro Umezu and his colleagues at Waseda University, have succeeded in developing a technology that enables direct electrical connection between gold films deposited on ultrathin polymer films without using adhesives. This was achieved by developing a new bonding technology -water vapor plasma-assisted bonding(WVPAB), which enables direct bonding of electrodes without the use of adhesives. This technology will contribute to the integration of flexible electronics, and the resultant paper was published in the electronic edition of Science Advances on December 22.