A joint research group led by Professor Masahiro Nomura has developed a high-efficiency cooling technology that forms minute water channels (micro channels) in silicon chips and uses the heat of vaporisation of the water flowing through them. By combining a cooling water distribution structure called a “manifold structure” and a structure that uses capillary action called a “capillary structure” to facilitate contact of the cooling water with the semiconductor chip, they have achieved the world’s highest level of cooling efficiency, with a “coefficient of performance” of 100,000, which represents cooling performance. This enables AI chips and high-power electronic devices to improve performance and save energy, and is expected to contribute to the development of next-generation electronic devices and the realization of carbon neutrality. The resulting paper has been published in the 16 April online edition of Cell Reports Physical Science.
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